发明名称 VACUUM FILM-FORMING APPARATUS
摘要 PROBLEM TO BE SOLVED: To prevent falling of deposits from a shutter arranged between an evaporation source 3 and a workpiece, and accurize film thickness control by a highly responsive opening or closing action of the shutter, in a vacuum film-forming apparatus (A) for forming a film on the workpiece by vapor-depositing a depositing material sputtered from an evaporating source 3 in a vacuum chamber 1. SOLUTION: This vacuum film-forming apparatus is characterized by arranging two shutters 12 and 22 between the evaporation source 3 and the workpiece in the vacuum chamber 1, making the second shutter 22 on a workpiece side to be lighter than the first shutter 12 in the evaporation source 3 side so as to open or close at a high speed, opening the second shutter 22 after opening the first shutter 12 at a starting time of film-formation on the workpiece, and closing the first shutter 12 after closing the second shutter 22 at the finishing time. The highly responsive shutter 22 quickly opened and closed at a high speed, controls thickness of the film onto the workpiece with high accuracy, and prevents the depositing material, even when it is deposited on the first shutter 12 which opens or closes at a lower speed than the second shutter 22, from exfoliating and falling from the first shutter 12 due to a shock of the opening or closing action. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003221665(A) 申请公布日期 2003.08.08
申请号 JP20020021217 申请日期 2002.01.30
申请人 SHIN MEIWA IND CO LTD 发明人 YAMABE SHINICHI
分类号 B01J3/00;C23C14/24;(IPC1-7):C23C14/24 主分类号 B01J3/00
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