| 摘要 |
PROBLEM TO BE SOLVED: To enable the bonding between the electrode of an electronic component and a conductor pattern formed on a mounting board to be improved in mechanical strength and stability in a simple structure without adversely affecting the operation of the electronic component and to restrain heat released from the electronic component from adversely affecting its own operation. SOLUTION: An electronic device 10 is equipped with a mounting board 11 provided with a conductor pattern 12 exposed on the one surface 11a of the electronic device 10, an electronic component 13 which is provided with connection electrodes 14 that are located on its one surface 13a which confronts the surface of 11a of the mounting board 11 and electrically, mechanically connected to the conductor pattern 12, a heat dissipating cap 30 which is brought into contact with the electronic component 13 to dissipate heat released from the electronic component 13, and a resin film 15 which covers the electronic component 13, the mounting board 11, and the heat dissipating cap 30 and is bonded to the mounting board 11. COPYRIGHT: (C)2003,JPO
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