| 摘要 |
PROBLEM TO BE SOLVED: To provide a die bonding apparatus for introducing automation for mounting electronic components to a metal stem. SOLUTION: In the die bonding apparatus 1, it is requested that a stem 2 is surely placed on a stem mounting head 6 without any displacement, after the stem 2 is mounted on the stem mounting head 6, when an electronic component S is placed on the component mounting surface 27 of the stem 2 and during the heating process of a stem base 24 by a heater 9. Therefore, a chuck 40 is also provided to the stem mounting head 6 and the stem 2 can be fixed and maintained to the stem mounting head 6 by holding the circumference 24a of the stem base 24 by the chuck 40. Moreover, the chuck 40 is introduced for corresponding to various shapes of the stem base 24 of stem 2 and it can be considered as an effective means for introducing automation to the die bonding apparatus 1. COPYRIGHT: (C)2003,JPO
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