| 发明名称 |
Semiconductor device having wiring line with hole, and manufacturing method thereof |
| 摘要 |
A semiconductor device includes a first wiring line having a first through hole, and a first connection member which extends through the first through hole at an interval from the first wiring line.
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| 申请公布号 |
US2003146515(A1) |
申请公布日期 |
2003.08.07 |
| 申请号 |
US20030357357 |
申请日期 |
2003.02.04 |
| 申请人 |
KAJIYAMA TAKESHI |
发明人 |
KAJIYAMA TAKESHI |
| 分类号 |
H01L21/768;G11C11/16;H01L21/8242;H01L21/8246;H01L23/522;H01L27/00;H01L27/06;H01L27/105;H01L27/22;H01L43/08;(IPC1-7):H01L23/48 |
主分类号 |
H01L21/768 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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