发明名称 |
HIGH-PERFORMANCE LAMINATE FOR INTEGRATED CIRCUIT INTERCONNECTION |
摘要 |
A high-performance, integrated circuit interconnection laminate. Power/ground layers in laminates fabricated with open areas to permit out gassing of gases generated during high temperature lamination are located such that they do not lie under/over critical traces on signal layers. This placement of the open areas enables a reduction in cross-talk between signal layers lying on opposite sides of a power/ground layer and a reduction in signal delay.
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申请公布号 |
US2003148077(A1) |
申请公布日期 |
2003.08.07 |
申请号 |
US20020072261 |
申请日期 |
2002.02.07 |
申请人 |
DEVNANI NURWATI S.;BURTON WILLIAM S.;CHRISTENSEN SARI K. |
发明人 |
DEVNANI NURWATI S.;BURTON WILLIAM S.;CHRISTENSEN SARI K. |
分类号 |
H01L23/498;H05K1/02;H05K3/46;(IPC1-7):B32B3/00 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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