| 摘要 |
A light emitting diode includes a lower electrode, a semiconductor substrate, a lower cladding layer, an action layer, an upper cladding layer, a window diffusion layer, and a composite upper electrode. The composite upper electrode includes an ohmic contact layer formed on a partial surface of the window diffusion layer, and a conductive transparent connecting oxidation layer coated on the ohmic contact layer and directly coated on a partial surface of the window diffusion layer to connect the ohmic contact layer and a wiring metal electrode layer.
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