| 摘要 |
The probe card of the present invention permits testing of a semiconductor device-under-test under high temperatures and includes a plurality of printed circuit boards stacked together to form a probe interface board having a top surface and a lower testing face. A heat sink is mounted on the probe interface board at the top surface and extends to the lower testing face. A needle supporting module is carried by the heat sink at the lower testing face and has a plurality of probe needles for electrically connecting to electrical contacts of a semiconductor device-under-test.
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