发明名称 Anordnung zur Kontaktierung von elektronischen Bauelementen auf flexiblen Substraten
摘要 The method involves making use of the elasticity of the substrate (4) and of other elastic auxiliary elements if appropriate to produce contact forces. The elastic deformation is caused by third components, generally described as contact force generating or introducing elements (3,6), so that an unrestrictedly reversible force or force and shape-locking contact joint exists between the chip (5) connection and the corresponding contact structure.
申请公布号 DE19833131(C2) 申请公布日期 2003.08.07
申请号 DE1998133131 申请日期 1998.07.23
申请人 INFINEON TECHNOLOGIES AG 发明人 HANKE, ANDRE
分类号 H01L21/56;H01L23/42;H05K3/32 主分类号 H01L21/56
代理机构 代理人
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