POLISHING HEAD, POLISHING DEVICE AND POLISHING METHOD

摘要

A polishing head (61) comprising a disc−like carrier (16) for holding at the lower surface thereof one surface of a wafer (W), and an annular retainer ring (17) disposed concentrically with, and on the outer periphery of, the carrier (16), held at the inner peripheral surface (17a) thereof by the carrier (16) while in contact with a polishing pad (4) at polishing, and locking the outer periphery of the wafer (W). The carrier (16) is formed with a flow passage (62) for supplying slurry or a cleaning liquid into a clearance (K) between an outer peripheral surface (16a) and the inner peripheral surface (17a) of the retainer ring (17). The flow passage (62) is connected with a slurry/cleaning liquid supply mechanism (31) for selectively supplying either slurry or a cleaning liquid to the passage (62).