METHOD OF BONDING WAFERS WITH CONTROLLED HEIGHT AND ASSOCIATED STRUCTURES
摘要
Different techniques may be used to realize the simultaneous provision of bonding material at a controlled height on a wafer level. These techniques include photolithographically patterning a layer of bonding material and providing spacer elements on a wafer then contacting another surface having the bonding material provided thereon to transfer the bonding material to the spacer elements. The patterning of the bonding material may include using a mask direct contact with or spaced from the bonding material. The providing of the spacer elements may include forming the spacers in the wafer itself or attaching spacer elements, particularly a wafer of spacer elements. The resultant integrated structure has controlled spacing between the bonded elements.
申请公布号
WO0227363(A3)
申请公布日期
2003.08.07
申请号
WO2001US29955
申请日期
2001.09.26
申请人
DIGITAL OPTICS CORPORATION;KATHMAN, ALAN, D.;MILLER, HARRIS, R.;MATHEWS, JAY;GRABINER, STACEY;HEYWARD, WADDIE