Halogen-free nonflammable epoxy resin composition, halogen-free nonfammable epoxy resin composition for build-up type multi-layer board, prepreg, copper-clad laminate, printed wiring board, copper foil-attached resin film, carrier-attached resin film, build-up type laminate, and build-up type multi-layer board

摘要

A halogen-free nonflammable epoxy resin composition, which comprises, as essential components (A) at least one kind of a cross-linked phenoxyphosphazene compound, (B) at least one kind of polyepoxide compound such as bisphenol A epoxy resin, (C) a curing agent for epoxy such as bisphenol A novolac resin, and (D) a cure promoter for epoxy, wherein the epoxy resin composition further comprises 0 to 50% by weight of an inorganic filler.