发明名称 METHODS AND COMPOSITIONS FOR CHEMICALLY TREATING A SUBSTRATE USING FOAM TECHNOLOGY
摘要 The present invention relates to methods and compositions for treating a surface of a substrate by foam technology that includes at least one treatment chemical. The invention more particularly relates to the removal of undesired matter from the surface of substrates with small features, where such undesired matter may comprise organic and inorganic compounds such as particles, films from photoresist material, and traces of any other impurities such as metals deposited during planarization or etching. A method according to the present invention for treating a surface of a substrate comprises generating a foam from a liquid composition, wherein the liquid composition comprises a gas; a surfactant; and at least one component selected from the group consisting of a fluoride, a hydroxylamine, an amine and periodic acid; contacting the foam with the surface of a substrate; and, removing the undesired matter from the surface of the substrate.
申请公布号 WO03064581(A1) 申请公布日期 2003.08.07
申请号 WO2002US03233 申请日期 2002.01.28
申请人 EKC TECHNOLOGY, INC. 发明人 PATEL, BAKUL, P.;CERNAT, MIHAELA;SMALL, ROBERT, J.
分类号 B01F17/00;B81C1/00;C23G1/06;H01L21/02;H01L21/306;H01L21/321;H01L21/3213 主分类号 B01F17/00
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