发明名称 |
ENCAPSULATION OF ORGANIC ELECTRONIC DEVICES USING ADSORBENT LOADED ADHESIVES |
摘要 |
Disclosed herein are organic electronic devices that are encapsulated at least in part by adsorbent-loaded transfer adhesives. The adsorbent material may be a dessicant and/or a getterer. The adsorbent-loaded transfer adhesive may form a gasket around the periphery of the device, or may cover the entire device and its periphery. An encapsulating lid covers the device. |
申请公布号 |
WO03065470(A1) |
申请公布日期 |
2003.08.07 |
申请号 |
WO2002US38144 |
申请日期 |
2002.11.26 |
申请人 |
3M INNOVATIVE PROPERTIES COMPANY |
发明人 |
MCCORMICK, FRED, B.;BAUDE, PAUL, F.;HAASE, MICHAEL, A. |
分类号 |
H05B33/04;H01L51/50;H01L51/52;H05B33/10 |
主分类号 |
H05B33/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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