发明名称 |
EPOXIDHARZZUSAMMENSETZUNG FÜR DIE VERSIEGELUNG VON HALBLEITERANORDNUNGEN |
摘要 |
An epoxy resin composition useful as a encapsulating material for photosemiconductor elements such as a photodetector or a light emittor and comprising an epoxy resin, a hardener and at least one compound represented by the following general formula (1) or (2). It can realize an excellent mold releasability from a forming die in transfer molding and the like and also give a encapsulating resin excellent in transparency. <CHEM> wherein Y1 represents -H, -RCOOH, -COR' or -R' wherein R is a bivalent organic group and R' is an alkyl group whose carbon number is not more than 30; x represents a positive number of 8 to 200 and is a mean value; and n is set in such a manner that the weight ratio of the repeating unit n accounts for 25 to 95% by weight based on the whole compound. <CHEM> wherein R represents a bivalent organic group, Y2 represents a metal atom having the valence of one or more, m represents a positive integer corresponding to the valence of Y2, x represents a positive number of 8 to 200 and is a mean value; and n is set in such a manner that the weight ratio of the repeating unit n accounts for 25 to 95% by weight based on the whole compound. |
申请公布号 |
DE69531191(D1) |
申请公布日期 |
2003.08.07 |
申请号 |
DE1995631191 |
申请日期 |
1995.11.07 |
申请人 |
NITTO DENKO CORP., IBARAKI |
发明人 |
HARADA, TADAAKI;UENISHI, SHINJIROU;KOUYAMA, HIROKATSU;MARUHASHI, TAKAHIKO;SHIMADA, KATSUMI;TANIGAWA, SATOSHI |
分类号 |
C08G59/40;C08L63/00;C08L71/02;H01L23/29;H01L23/31;H01L31/0203 |
主分类号 |
C08G59/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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