发明名称 |
Electronic assembly having composite electronic contacts for attaching a package substrate to a printed circuit board |
摘要 |
Electronic contacts, including spherical cores and attachment layers on the cores, are provided for attaching a semiconductor package substrate to a printed circuit board. The spherical cores are made of high-melting-temperature copper, and the attachment layers are made of a low-melting-temperature eutectic. The attachment layers melt in a reflow process. The spherical cores do not melt, and thereby control movement or "collapsing" of the package substrate toward the printed circuit board.
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申请公布号 |
US2003146505(A1) |
申请公布日期 |
2003.08.07 |
申请号 |
US20020068494 |
申请日期 |
2002.02.04 |
申请人 |
MARTIN EDWARD L.;BIGGS L. TODD |
发明人 |
MARTIN EDWARD L.;BIGGS L. TODD |
分类号 |
H01L21/48;H01L23/498;H01L23/64;H05K1/02;H05K3/34;(IPC1-7):H01L21/44;H01L23/48 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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