发明名称 Electrode connection method, electrode surface activation apparatus, electrode connection apparatus, connection method of electronic components and connected structure
摘要 An electrode connecting method of connecting a first electrode and a second electrode is disclosed. The respective bonding surfaces of the first and second electrodes are activated. Then, each of the first and second electrodes having the activated surfaces is coated with a coating member for maintaining an activated state. A solid state bond between the first electrode and the second electrode is formed by pressure welding the first electrode and the second electrode so that the first and second electrodes break through the coating members.
申请公布号 US2003148593(A1) 申请公布日期 2003.08.07
申请号 US20030347224 申请日期 2003.01.21
申请人 FUJITSU LIMITED 发明人 OKAMOTO KEISHIRO;MIZUKOSHI MASATAKA;YAMAGISHI YASUO
分类号 H01L21/56;H05K3/32;H05K3/34;(IPC1-7):H01L21/46;H01L21/44;H01L21/30;H01L21/476 主分类号 H01L21/56
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