发明名称 |
Curable composition and multilayered circuit substrate |
摘要 |
This invention provides a multi-layer circuit board excellent in flame resistance, insulating property and adhesion and not generating detrimental substances when burnt, and a curable composition suitable for obtaining the multi-layer circuit board. The curable composition contains an insulating resin such as an alicyclic olefin polymer or an aromatic polyether polymer, a nitrogen-type curing agent such as 1,3-diallyl-5-glycidyl isocyanurate and a phosphorus-type flame retardant such as phosphoric acid ester amide, and is molded into a film by a solution casting method. The film so formed is laminated on an internal layer board and is cured to give the multi-layer circuit substrate.
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申请公布号 |
US2003146421(A1) |
申请公布日期 |
2003.08.07 |
申请号 |
US20020240400 |
申请日期 |
2002.09.30 |
申请人 |
WAKIZAKA YASUHIRO;YUYAMA KANJI |
发明人 |
WAKIZAKA YASUHIRO;YUYAMA KANJI |
分类号 |
B32B15/08;C08G65/48;C08K3/32;C08K5/14;C08K5/16;C08K5/49;C08L45/00;C08L63/10;C08L65/00;C08L71/12;H05K1/03;H05K3/46;(IPC1-7):C09K21/00 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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