发明名称 A LEAD FRAME
摘要 <p>A lead frame (1) has a first portion (2) adapted to have a semiconductor device (10) mounted thereon and a second portion (3) including a main member (5), a number of first contact members (6) and a number of second contact members (7). The first and second contact members (6, 7) depend from the main member (5). The second portion (3) at least partially surrounds the first portion (6). The first contact members (6) extend form the main member (5) in a direction away for the first portion (2) and the second contact members (7) extend from the main member (5) in a direction towards the first portion (2).</p>
申请公布号 WO2003065452(P1) 申请公布日期 2003.08.07
申请号 SG2002000014 申请日期 2002.02.01
申请人 发明人
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代理机构 代理人
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