发明名称 Fixing system for a power semiconductor module which comprises a substrate carrying power electronic components, a central hole in the substrate and a clamping screw for a heat spreader plate
摘要 Fixing system for a power semiconductor module which comprises a substrate (10) carrying power electronic components, a central hole (16) in the substrate and a clamping screw for a heat spreader plate (14).
申请公布号 DE10203096(A1) 申请公布日期 2003.08.07
申请号 DE2002103096 申请日期 2002.01.25
申请人 DANFOSS SILICON POWER GMBH 发明人 LIEBSCH, ANDREAS;ULRICH, HOLGER;EISELE, RONALD
分类号 H01L25/07;H01L25/11;(IPC1-7):H01L23/40;H01L23/06 主分类号 H01L25/07
代理机构 代理人
主权项
地址