发明名称 |
Fixing system for a power semiconductor module which comprises a substrate carrying power electronic components, a central hole in the substrate and a clamping screw for a heat spreader plate |
摘要 |
Fixing system for a power semiconductor module which comprises a substrate (10) carrying power electronic components, a central hole (16) in the substrate and a clamping screw for a heat spreader plate (14). |
申请公布号 |
DE10203096(A1) |
申请公布日期 |
2003.08.07 |
申请号 |
DE2002103096 |
申请日期 |
2002.01.25 |
申请人 |
DANFOSS SILICON POWER GMBH |
发明人 |
LIEBSCH, ANDREAS;ULRICH, HOLGER;EISELE, RONALD |
分类号 |
H01L25/07;H01L25/11;(IPC1-7):H01L23/40;H01L23/06 |
主分类号 |
H01L25/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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