FLIP CHIP DIE BOND PADS, DIE BOND PAD PLACEMENT AND ROUTING OPTIMIZATION

摘要

An integrated circuit die for a flip chip has circular die bond pads (122). Circular die bond pads allows for a higher density of bond pads when a mating printed circuit board has routing lines between its corresponding pads. In one form, there is provided a flip chip having a die (120) and a plurality of die bond pads (122) situated on the die. Each die bond pad of the die is circular.