| 发明名称 |
Method for creating adhesion during fabrication of electronic devices |
| 摘要 |
A method for creating adhesion includes plasma treating two substrates and thereafter contacting the substrates. The method can be used on a variety of dry surfaces. The method is used to adhere nonadhesive surfaces such as a cured silicone with a ceramic or semiconductor. |
| 申请公布号 |
US2003145940(A1) |
申请公布日期 |
2003.08.07 |
| 申请号 |
US20010973498 |
申请日期 |
2001.10.09 |
| 申请人 |
CHAUDHURY MANOJ KUMAR;GOODWIN ANDREW JAMES;LEE YEONG JOO;PARBHOO BHUKANDAS |
发明人 |
CHAUDHURY MANOJ KUMAR;GOODWIN ANDREW JAMES;LEE YEONG JOO;PARBHOO BHUKANDAS |
| 分类号 |
H01L21/52;C09J5/02;H01L21/48;H01L21/58;H05K3/30;H05K3/38;(IPC1-7):B32B31/00 |
主分类号 |
H01L21/52 |
| 代理机构 |
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代理人 |
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| 主权项 |
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