CARRIER PLATE FOR MICRO-HYBRID CIRCUITS

摘要

The invention relates to a substrate board (2) for micro hybrid integrated circuits (7) having a ceramic body (3). According to the present invention, provision is made that the ceramic body (3) is a porous body, whose cavities are filled with aluminum. Due to the relatively small difference in thermal expansion coefficients of the substrate board (2) and the micro hybrid integrated circuit (7), a very good thermal bond of the micro hybrid integrated circuits (7) to the substrate board (2) is possible.