| 摘要 |
A cooling device for dissipating heat to the surrounding air from at least one heat-generating component mounted on a surface, the cooling device comprising: a heat-sink having a plurality of heat-conducting sections arranged in a low- profile configuration providing large surface-to-air contact area defined by high ratio of air-passage-area to the area of the heat-conducting-sections; wherein at least one of the heat-conducting sections is in thermal contact with the heat-generating component so as to facilitate thermal flow from the heat-generating component to the air via at least one of said heat-conducting sections; wherein the heat sink is adapted to operate with air-moving means, and wherein the cooling device and the air-moving means provide reduced thermal-flow resistance from the at least one of the heat-conducting sections in contact with the heat-generating component to the air, per specific volume occupied by the cooling device. |
