发明名称 Conductive adhesive material with metallurgically-bonded conductive particles
摘要 A conductive adhesive material (12) characterized by metallurgical bonds (24) between electrically-conductive particles (20) dispersed in a polymer matrix (22) of the material (12). The polymer matrix (22) has a fluxing capability when heated to reduce metal oxides on the surfaces of the particles (20). At least the outer surfaces of the particles (20) are formed of a fusible material, so that sufficiently heating the conductive adhesive material (12) will reduce metal oxides on the particles (20), and at least partially melt the fusible metal, enabling the particles (20) to metallurgically bond to each other and to metal surfaces (14,16,44,46,54,56) contacted by the adhesive material (12).
申请公布号 EP1333079(A1) 申请公布日期 2003.08.06
申请号 EP20030075164 申请日期 2003.01.17
申请人 DELPHI TECHNOLOGIES, INC. 发明人 CHAUDHURI, ARUN K.;STEPNIAK, FRANK;WALSH, MATTHEW R.
分类号 C08L63/00;C09J9/02;C09J163/00;H01B1/22;H05K3/32;H05K3/34;(IPC1-7):C09J9/02;C08K3/08;C08K9/02 主分类号 C08L63/00
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