APPARATUS AND METHOD FOR TESTING CHIP

摘要

PURPOSE: An apparatus and a method for testing a chip are provided to minimize the defective proportion of a semiconductor package by testing the short circuit of a wire, the opening state of the wire, and the leak current of the wire after a die bonding process or a wire bonding process. CONSTITUTION: An apparatus for testing a chip includes a loading unit, a test unit, and an unloading unit. The loading unit is used for loading a strip PCB(Printed Circuit Board). The test unit is used for testing the strip PCB by checking the short circuit of a wire, the opening state of the wire, and the leak current of the wire. The unloading unit is used for unloading the strip PCB by separating the strip PCB according to a decision result of the test unit. The apparatus for testing the chip further includes a marking unit(526) and a host system. The marking unit is used for marking a bad mark to indicate the bad state of the strip PCB. The host system is used for driving the marking unit.