发明名称 Transfer molding process for an integrated circuit and pre-formed release film for use in this process
摘要 <p>A system and method is disclosed for using a pre-formed film in a transfer molding process of the type that uses a transfer mold to encapsulate portions of an integrated circuit with a molding compound. A film of compliant material is pre-formed to conform the shape of the film to a mold cavity surface of the transfer mold. The pre-formed film is then placed adjacent to the surfaces of the mold cavity of the transfer mold. The mold cavity is filled with molding compound and the integrated circuit is encapsulated. The preformation of the film allows materials to be used that are not suitable for use with prior art methods. <IMAGE></p>
申请公布号 EP1333480(A2) 申请公布日期 2003.08.06
申请号 EP20030250537 申请日期 2003.01.29
申请人 STMICROELECTRONICS, INC. 发明人 SIEGEL, HARRY MICHAEL;CHIU, ANTHONY M.
分类号 B29C45/02;B29C45/14;H01L21/56;H01L23/28;H01L23/31;(IPC1-7):H01L21/56 主分类号 B29C45/02
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