发明名称 |
Conductive paste for filing via-hole, double-sided and multilayer printed circuit boards using the same, and method for producing the same |
摘要 |
<p>A paste for via-hole filling is provided, and the paste comprises at least (a) 30-70 volume % of conductive particles whose average diameter ranges from 0.5 to 20 mu m and whose specific surface area ranges from 0.05 to 1.5m<2>/g, and (b) 70-30 volume % of resin comprising at least 10 weight % of epoxy resin comprising at least one epoxy group per molecule, in which the total amount of a hydroxyl group, an amino group and a carboxyl group is not more than 5 mol% of the epoxy group, and the epoxy equivalent ranges from 100 to 350g/eq. The conductive paste for filling via-holes and a printed circuit board comprising thereof can be used to provide an inner-via-hole connection between electrode layers without using a through-hole plating technique. <IMAGE></p> |
申请公布号 |
EP0955795(B1) |
申请公布日期 |
2003.08.06 |
申请号 |
EP19990108590 |
申请日期 |
1999.05.07 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
OMOYA, KAZUNORI;SUZUKI, TAKESHI;OGAWA, TATSUO;OOBAYASHI, TAKASHI |
分类号 |
H05K1/09;H05K3/40;H05K3/46;(IPC1-7):H05K1/09 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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