| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor sealing resin composition excellent in flame retardance, fluidity and moisture resistance, and to provide a semiconductor system using the same. SOLUTION: The semiconductor sealing resin composition comprises an epoxy resin or a phenol resin, an inorganic filler and a tetrazol compound. The tetrazol compound is preferably a 5,5'-bistetrazol compound, may be an inorganic salt or an organic salt, has preferably a heat decomposition temperature of 300°C or more, and can be decomposed by heat to generate no dioxin, but an environmental pollution-irrelevant and flame-retardant gas such as a nitrogen gas, a carbon dioxide gas, an ammonia gas and a water vapor. The semiconductor system is formed by encapsulating a semiconductor device with the resin composition by a transfer molding method or encapsulating the electrode surface of a semiconductor device with a sheet of the composition. COPYRIGHT: (C)2003,JPO
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