APPARATUS FOR PRODUCING DEPOSITED PLATE

摘要

PROBLEM TO BE SOLVED: To securely take out a deposited plate that is produced without falling during conveyance using a simple construction. SOLUTION: An apparatus for producing a semiconductor substrate (apparatus for producing a deposited plate) in which a semiconductor substrate (deposited plate) is produced by solidifying and growing a material to be melted on a substrate surface 14a of a substrate for deposition 14 comprises a crucible device (melting furnace device) in which the material to be melted is contained while being heated to be a molten metal; a deposition mechanism in which the substrate for deposition 14 is immersed in the molten metal of the material to be melted and then the substrate for deposition 14 is moved out of the crucible device while being pulled up; and a peeling mechanism 85 in which when the whole of the substrate for deposition 14 reaches a peeling position outside of the upper part of crucible device, the semiconductor substrate 2 is peeled off the substrate surface 14a of the substrate for deposition 14. COPYRIGHT: (C)2003,JPO