METHOD FOR PUNCHING RESIN SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a method for punching a resin substrate capable of forming a through hole having a high aspect ratio on the resin substrate by a press processing, and straightly forming the through hole preventing contraction of the hole diameter of the through hole and generation of a resin smear. SOLUTION: The through hole 4 is formed by executing punch action on the resin substrate 1 with a punch 22 of the same diameter at the same position of a die hole 26 a plurality of times using the punch 22 and the die 25. COPYRIGHT: (C)2003,JPO