发明名称 MOLDING DIE UNIT
摘要 PROBLEM TO BE SOLVED: To provide a molding die unit which is free from a disproportional flow of a temperature controlling liquid and is excellent in a cooling effect. SOLUTION: The molding die unit is provided with a nested cooler 4 having a roughly cylindrical fitting bore 6 in its center, an insert 7 to be inserted into the fitting bore 6, and a route 8 for the temperature controlling liquid between the outer periphery of the insert 7 and the inner periphery of the fitting bore 6. The route 8 for the temperature controlling liquid is composed of an approach route 11 for the temperature controlling liquid which is set spirally from a rear end side 9 to a front end side 10 of the nested cooler 4 and a withdrawal route 12 for the temperature controlling liquid which is set spirally from the front end side to the rear end side of the nested cooler 4 and communicates with the approach route 11. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003220637(A) 申请公布日期 2003.08.05
申请号 JP20020019781 申请日期 2002.01.29
申请人 MITSUBISHI MATERIALS CORP 发明人 KIYONO YOSHIHIRO;HORIKAWA YOSHIHIRO
分类号 B29C45/73;B29C33/04;(IPC1-7):B29C45/73 主分类号 B29C45/73
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