发明名称 CIRCUIT BODY WIRING STRUCTURE TO VEHICLE RESIN PANEL
摘要 <P>PROBLEM TO BE SOLVED: To provide circuit body wiring structure to a vehicle resin panel capable of improving workability, a disassemble property and a recycle property and rationalizing itself. <P>SOLUTION: A plurality of pairs of wiring pins 5, 5 is provided on a door inner panel 2 as the vehicle resin panel. Additionally, a plurality of plates 6 installed by straddling over the pairs of the wiring pins 5, 5 is provided. In this way, the door inner panel 2 is imparted with a function as a wiring plate. Thereafter, it is devised to simultaneously carry out manufacture of a wire harness as a circuit body and wiring to the door inner panel 2. Side surfaces of the wiring pins 5, 5 are tapered. Additionally, engagement parts to hook the plates 6 are formed on the side surfaces. Furthermore, all the intervals of the wiring pins 5, 5 are made the same. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003220902(A) 申请公布日期 2003.08.05
申请号 JP20020019551 申请日期 2002.01.29
申请人 YAZAKI CORP 发明人 KISU NAOKI;SOSHINO EMI
分类号 B60R16/02;H01B7/00;H02G3/30;H02G3/38 主分类号 B60R16/02
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