发明名称 |
MOLDING BODY TAKEOFF METHOD AND MOLDING BODY TAKEOFF DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a molding body takeoff method in which the molding body pulled out from a die hole so as to make the main face of the molding body in parallel in the pulling-out direction can be horizontally arranged at a prescribed position without damaging it, and a molding body takeoff device. SOLUTION: After one main face of the molding body F pulled out from the die hole 106 of a die 104 is supported by a support member 16, the other main face of the molding body F is evacuated by a suction member 48. Impact of the molding body F during sucking is absorbed by an impact absorbing member 50. The molding body F is carried to a mesh-like carrying belt 120 in a state that the other main face of the molding body F is sucked and the molding body F is horizontally arranged on the carrying belt 120 by turning one main face of the molding body F downward. After that, powder-removing- treatment is applied to the molding body F. COPYRIGHT: (C)2003,JPO
|
申请公布号 |
JP2003220499(A) |
申请公布日期 |
2003.08.05 |
申请号 |
JP20020015382 |
申请日期 |
2002.01.24 |
申请人 |
SUMITOMO SPECIAL METALS CO LTD |
发明人 |
TANAKA ATSUO;MATSUGAMI SHOICHI;IWASAKI TADAHIRO |
分类号 |
B30B11/00;(IPC1-7):B30B11/00 |
主分类号 |
B30B11/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|