| 发明名称 |
Dissolution of metal particles produced by polishing |
| 摘要 |
A method for polishing a surface of metal on a semiconductor substrate by using a polishing pad and hydrogen peroxide, and removing particles of metal from the semiconductor substrate by polishing, and dissolving the particles in the quantity of hydrogen peroxide.
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| 申请公布号 |
US6602112(B2) |
申请公布日期 |
2003.08.05 |
| 申请号 |
US20010764817 |
申请日期 |
2001.01.18 |
| 申请人 |
RODEL HOLDINGS, INC. |
发明人 |
TRAN TONY QUAN;SACHAN VIKAS;GETTMAN DAVID;THOMAS TERENCE M.;LACK CRAIG D.;BURKE PETER A. |
| 分类号 |
B24B31/16;B24B37/04;B24B49/04;B24B49/12;(IPC1-7):B24B1/00 |
主分类号 |
B24B31/16 |
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