| 摘要 |
A package substrate having sides, which is formed of multiple non electrically conductive layers laminated together. Each of the multiple non electrically conductive layers is formed of a first lamina and a second lamina bonded together in a resin matrix. The first lamina is formed of woven fibers having a first warp. The first warp of the first lamina is disposed at a positive orientation of a first angle from the sides of the package substrate, where the first angle is neither zero degrees nor ninety degrees. The second lamina is also formed of woven fibers, having a second warp. The second warp of the second lamina is disposed at a negative orientation of the first angle from the sides of the package substrate. Electrically conductive layers are dispersed between different ones of the multiple non electrically conductive layers, with electrical connections dispersed between different ones of the electrically conductive layers.
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