发明名称 SUPPLY MECHANISM OF MULTI-GRADE MOLDING COMPOUND
摘要 PROBLEM TO BE SOLVED: To swiftly cope with small volume and multi-grade molding in which the alteration of a molding compound is carried out frequently, to suppress the reduction of productivity and along with this, and to prevent an increase in facilities. SOLUTION: As the supply of the molding compound to a molding machine 10 can be altered by simply changing the connection of a supply hose 28 to a loader 14, the trouble (removing or cleaning the molding compound from a hopper dryer and a hose or the like) due to the alteration of the molding compound in small volume and multi-grade molding operations can be eliminated. Also, owing to having the structure of compression coupling, the molding compound does not leak in the process of the supply thereof and a granular diameter is not limited to. Further, a plug member 38 can be attached to the supply hose 28 corresponding to the line of a twin hopper dryer 12, which is not applied, thereby preventing the leakage of the molding compound from the twin hopper dryer 12. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003220611(A) 申请公布日期 2003.08.05
申请号 JP20020022357 申请日期 2002.01.30
申请人 FUJI KIKI KOGYO KK 发明人 INOUE SHOICHI;SUZUKI HIROSHI
分类号 B29C31/10;B29K101/00;(IPC1-7):B29C31/10 主分类号 B29C31/10
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