| 摘要 |
PROBLEM TO BE SOLVED: To overcome limits such that there is a limit in corresponding to reduction of the diameter and the depth even though shape accuracy of the size or the like in mechanical machining to a hard and brittle material such as ceramics, glass, silicon is relatively excellent, for example, the diameter of a hole with several hundreds microns is a limit in boring, it is very difficult to bore a hole with several hundreds microns or less in diameter, and the limit of the depth to the diameter (an aspect ratio) is 5-10. SOLUTION: Boring of very fine diameter and grooving of a hard and brittle hard-to-cut material can be facilitated by assisting removal of machining chips with so-called a surface wave and by suppressing increase of frictional resistance between the tool tip and an object to be machined by applying ultrasonic vibration in the longitudinal direction to a mechanical machining table for mounting the object to be machined. COPYRIGHT: (C)2003,JPO
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