Automated polishing apparatus and method of polishing

摘要

A polishing system for polishing a surface of a substrate, such as the surface of an optical pin mold, to a desired surface finish and profile under the automated control of a computer during a polishing cycle. The polishing system includes a polishing spindle assembly that holds and rotates a polishing tool that is contacted under pressure with a surface of the mold pin. A torque sensor is associated with the polishing spindle assembly to sense a torque on the polishing tool during the polishing cycle. The polishing system further includes a feedback control system that dynamically adjusts the position of the polishing spindle assembly in response to the torque sensed by the torque sensor to maintain a substantially constant torque on the polishing tool during the polishing cycle.