发明名称 |
Method and apparatus for reducing PFC emission during semiconductor manufacture |
摘要 |
A method of reducing PFC emissions during a semiconductor manufacturing process that includes a set of sub-processes each of which produces at least one PFC includes the steps of exhausting PFC's produced by each sub-process to a common line to form a combined exhaust stream, treating the combined exhaust stream from each sub-process using a separate PFC abatement system, combining the treated exhaust streams to form a combined treated stream, and wet scrubbing the combined treated stream.
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申请公布号 |
US6602323(B2) |
申请公布日期 |
2003.08.05 |
申请号 |
US20010946632 |
申请日期 |
2001.09.06 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHAE SEUNG-KI;LEE SANG-GON;CHUNG SANG-HYUK;HEO SEONG-JIN |
分类号 |
B01D53/68;B01D53/34;B01D53/70;B01D53/77;C23C16/44;H01L21/205;H01L21/302;H01L21/3065;(IPC1-7):B01D50/00 |
主分类号 |
B01D53/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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