发明名称 Method and apparatus for reducing PFC emission during semiconductor manufacture
摘要 A method of reducing PFC emissions during a semiconductor manufacturing process that includes a set of sub-processes each of which produces at least one PFC includes the steps of exhausting PFC's produced by each sub-process to a common line to form a combined exhaust stream, treating the combined exhaust stream from each sub-process using a separate PFC abatement system, combining the treated exhaust streams to form a combined treated stream, and wet scrubbing the combined treated stream.
申请公布号 US6602323(B2) 申请公布日期 2003.08.05
申请号 US20010946632 申请日期 2001.09.06
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHAE SEUNG-KI;LEE SANG-GON;CHUNG SANG-HYUK;HEO SEONG-JIN
分类号 B01D53/68;B01D53/34;B01D53/70;B01D53/77;C23C16/44;H01L21/205;H01L21/302;H01L21/3065;(IPC1-7):B01D50/00 主分类号 B01D53/68
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