| 发明名称 |
Electrically conductive paste and method of forming circuit |
| 摘要 |
An electrically conductive paste is provided in that complexes A each made up of an electrically conductive filler 1 and a heating element 3 adapted to generate heat on electromagnetic induction are compounded with a resin 5.
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| 申请公布号 |
US6602446(B2) |
申请公布日期 |
2003.08.05 |
| 申请号 |
US20000725864 |
申请日期 |
2000.11.30 |
| 申请人 |
YAZAKI CORPORATION |
发明人 |
USHIJIMA HITOSHI |
| 分类号 |
H05K3/22;C08K3/00;H01L21/48;H01L23/498;H05K1/09;H05K3/12;(IPC1-7):H01B1/02;B05D5/12 |
主分类号 |
H05K3/22 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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