发明名称 Apparatus and method of overlapping formation of chamfers and orifices by laser light
摘要 The present invention provides an apparatus that can form a plurality of orifices where the orifices are consistent dimensionally, such as, for example, the diameter, the surface roughness or the entry and exit configurations. Preferably, the invention provides a laser machining apparatus. The apparatus includes a laser light source that provides a generally coherent light beam along the beam's axis. The apparatus also includes a light directing device to direct a first portion of light from the light beam to a work piece at a first angle of incidence relative to the axis of the light beam during a first time interval to form at least one of an orifice and a chamfer. The apparatus further includes an adjustable beam splitter assembly to direct another portion of the light beam to form the other of the at least one of an orifice and a chamfer in the work piece during a second time interval that overlaps a portion of the first time interval. The method includes providing at least a first beam and a second beam that are emitted from the laser light source towards the workpiece; and rotating at least a first beam and a second beam with respect to the longitudinal axis. The method further includes forming at least one orifice in the workpiece with at least one of the first and second beams during a first time interval; and forming the at least one chamfer in the workpiece with the other of the first and second beams during a second time interval that overlaps a portion of the first time interval.
申请公布号 US6603095(B2) 申请公布日期 2003.08.05
申请号 US20010909974 申请日期 2001.07.23
申请人 SIEMENS AUTOMOTIVE CORPORATION 发明人 HAMANN CHRISTOPH
分类号 B23K26/067;B23K26/38;F02M61/16;F02M61/18;(IPC1-7):B23K26/38 主分类号 B23K26/067
代理机构 代理人
主权项
地址