| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a phenol resin molding material that can provide a molding product having a good outer appearance with less solder sticking even if by solder dip treatment at near 500°C. <P>SOLUTION: This phenol resin molding material comprises (a) a resin component containing a resol-type phenol resin and hexamethylenetetramine, or a resol-type phenol resin and a novolac-type phenol resin and hexamethylenetetramine, and (b) an organic base having a loss in quantity by heating at 105°C of 5 wt.% or more and oil absorption of 180 ml/100 g or more, and furthermore can contain (c) an inorganic base. <P>COPYRIGHT: (C)2003,JPO</p> |
