发明名称 |
Method for controlling the formation of intermetallic compounds in solder joints |
摘要 |
The present invention relates to a method for controlling the formation of the intermetallic compounds in solder joints, The types of the intermetallic compounds between the SnAgCu solders and the Ni-bearing substrate can be controlled by adjusting the copper concentration in the SnAgCu solders. If the SnAgCu solder has a copper concentration higher than or equivalent to 0.6 wt. %, the soldering intermetallic compound includes a continuous (Cu1-xNix)6Sn5 layer. If the copper concentration of the SnAgCu solders is lower than or equivalent to 0.4 wt. %, the soldering intermetallic compound includes a continuous (Ni1-yCuy)3Sn4 layer and a non-continuous (Cu1-xNix)6Sn5 layer. If the copper concentration of the SnAgCu solders is between 0.4 wt. % to 0.6 wt. %, the soldering intermetallic compound includes the continuous (Cu1-xNix)6Sn5.
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申请公布号 |
US6602777(B1) |
申请公布日期 |
2003.08.05 |
申请号 |
US20020104085 |
申请日期 |
2002.03.20 |
申请人 |
NATIONAL CENTRAL UNIVERSITY |
发明人 |
KAO CHENG-HENG;HO CHENG-EN |
分类号 |
B23K35/26;H05K3/24;H05K3/34;(IPC1-7):H01L21/44 |
主分类号 |
B23K35/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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