| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an active ray-curing polyimide resin composition having heat resistance, capable of patterning with an aqueous dilution alkaline solution and soluble in organic solvents. <P>SOLUTION: The active ray-curing polyimide resin composition comprises (I) a polymerizable polyimide resin and, if necessary, (II) an organic solvent, (III) an epoxy resin and (IV) a photopolymerization initiator, wherein the polymerizable polyimide resin contains an isocyanurate ring, a cyclic aliphatic structure, an imide ring and a (meth)acryloyl group and allows of patterning with an aqueous dilution alkaline solution, preferably the isocyanurate ring having a concentration of 0.4-1.2 mmol/g, the (meth)acryloyl group having a concentration of 0.3-4 mmol/g, the polyimide resin having an acid value of 20-250, a number-average molecular weight of 1,000-20,000 and a weight-average molecular weight of 1,500-30,000. <P>COPYRIGHT: (C)2003,JPO |
