发明名称 |
Method for mounting a semiconductor chip on a substrate and semiconductor device adapted for mounting on a substrate |
摘要 |
A method for manufacturing a semiconductor device includes the steps of providing a semiconductor chip having a pad-mounting surface with a bonding pad, forming an inner bump on the bonding pad, and forming a conductive body on the pad-mounting surface. The conductive body has an anchor portion connecting electrically with and encapsulating the inner bump, and a contact portion offset from the anchor portion and adapted to be connected to a substrate.
|
申请公布号 |
US6602732(B2) |
申请公布日期 |
2003.08.05 |
申请号 |
US20020121782 |
申请日期 |
2002.04.11 |
申请人 |
COMPUTECH INTERNATIONAL VENTURES LIMITED |
发明人 |
CHEN I-MING |
分类号 |
H01L21/60;H01L23/485;H01L23/532;(IPC1-7):H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L21/60 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|