| 摘要 |
<p>PURPOSE: To provide a molding die that much stress is not applied to a resin package in releasing a lead frame after resin sealing. CONSTITUTION: In this method, the following processes are conducted in order: a process wherein lead frame 11 is set in a molding die which is constituted of an upper die 1 and a lower die, each of which has cavities 3 or 4, and which is so structured that resin may be led in by means of gates 6, 7, and 8 from a resin lead-in port through a runner 5. The gates 6, 7, and 8 are formed alternately in the upper die 1 and the lower die 2 for the cavities 3, 4 which are formed in series in the longitudinal direction; melted resin is injected through the resin lead in port of the molding die and thereby a plurality of the cavities 3, 4 are filled with the resin through the runner 5 and the gates 6, 7, and 8; after the resin in the cavities 3, 4 is hardened, a lead frame wherein semiconductor elements are resin-sealed is removed; a bending work is done for preparation of a surface-mounting face.</p> |
