| 发明名称 |
DIE-BONDING SOLDER MATERIALS |
| 摘要 |
A die-bonding solder material according to the present invention is so arranged as to be an eutectic including tin and gold with such a substantial composition ratio as having the eutectic point with a more content of tin than the content that of gold.
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| 申请公布号 |
US2003143103(A1) |
申请公布日期 |
2003.07.31 |
| 申请号 |
US19990445022 |
申请日期 |
1999.11.30 |
| 申请人 |
MASUDA TAKASHI |
发明人 |
MASUDA TAKASHI |
| 分类号 |
H01L23/488;(IPC1-7):C22C13/00 |
主分类号 |
H01L23/488 |
| 代理机构 |
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