CLUSTER PACKAGING OF LIGHT EMITTING DIODES

摘要

Methods of forming a light emitting diode are provided by scoring a semiconductor substrate having a light emitting region formed thereon so as to provide score lines between individual ones of a plurality of light emitting diodes. The semiconductor substrate is then broken along selected ones of the score lines so as to provide a unitized subset of the plurality of light emitting diodes. The unitized subset includes at least two light emitting diodes. Electrical connections are provided to the light emitting diodes of the unitized subset of the plurality of light emitting diodes. The score lines may also define the individual ones of the light emitting diodes.