| 摘要 |
The invention relates to a method for making an integrated circuit ( 40 ) of the surface-mount type the comprising, first of all, manufacture of a package having a rear face and a pin grid array extending under this rear face perpendicular thereto, and a ball ( 44 ) of low melting point alloy is then formed at the end of each pin surrounding this end and soldered thereto. The invention also relates to an integrated circuit ( 40 ) of the surface-mount type, comprising a package having a rear face and a pin grid array, of a cross section roughly constant along the pin ( 42 ), extending under the rear face perpendicular thereto. A ball ( 44 ) of low melting point alloy is soldered to the end of each pin ( 42 ) surrounding this end. |
