发明名称 SEMICONDUCTOR POWER CONVERSION DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To inexpensively provide a small and highly reliable semiconductor power conversion device having an excellent function. <P>SOLUTION: In the semiconductor power conversion device, two control substrates 109a and 109b are electrically connected by a flexible substrate 110, they are bent and are separately arranged above and below in a case 106. The two control substrates 109a and 109b are made into one continuous substrate at first. They are electrically connected by the flexible substrate 110. Necessary electronic parts are mounted on it and they are divided and separated. <P>COPYRIGHT: (C)2003,JPO</p>
申请公布号 JP2003218317(A) 申请公布日期 2003.07.31
申请号 JP20020010302 申请日期 2002.01.18
申请人 HITACHI LTD 发明人 KAWASE DAISUKE;USAMI KAZUO;BANDO AKIRA
分类号 H01L25/07;H01L25/18;H02M1/00;(IPC1-7):H01L25/07 主分类号 H01L25/07
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